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Mini-symposium on DIMAP at CENICS 2016 – ADAAM 2016 (Nice, 24/28-Jul-2016)

KIT is organising a mini-symposium in the CENICS 2016 (July 24 - 28, 2016) in Nice, France, named ADAAM 2016, Application-driven Advances in Additive Manufacturing Technologies, on July 26, 2016.

During the CENICS 2016 (The Ninth International Conference on Advances in Circuits, Electronics and Micro-electronics) Steffen Scholz from KIT has a Keynote Speech on Tuesday, July 26.

  • Application-driven Advances in Additive Manufacturing Technologies
    Dr.-Ing. Steffen G. Scholz, Karlsruhe Institute of Technology (KIT), Germany


The ADAAM symposium organized by KIT includes the following sessions:

CENICS 2: Application-driven Advances in Additive Manufacturing Technologies I

A Cost Model for SMARTLAM

Novel conductive inks for 3D printing

Novel nanoparticle enhanced Digital Materials for 3D Printing and their application shown for the robotic and electronic industry. Introduction on the DIMAP project

CENICS 3: Application-driven Advances in Additive Manufacturing Technologies II

Novel nanoparticle enhanced Digital Materials for 3D Printing and their application shown for the robotic and electronic industry. Application requirements

ADDMANU – An Austrian Lighthouse project for Additive Manufacturing

Novel FGMOS based Voltage Differencing Buffered Amplifier and its Filter Applications

 

The detailed program can be found online under: http://www.iaria.org/conferences2016/ProgramCENICS16.htm 


Call for papers was open until May 8th.Topics to be covered were (but not limited to):

  • Hybrid manufacturing
  • Material combination
  • Digital materials
  • New ink materials (ceramic, polymer, foam...)
  • Curing processes
  • Simulation based approaches
  • Additive manufacturing equipment
  • Software control
  • Innovative applications